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IC Chemical Processing
IC Failure Analysis
FIB Application
ESD/Latch-up Test
 
 
   芯片失效分析 →
SEM&EDX
Probe Station Application
EMMI Application
OBIRCH Application
LC Application
IC Grinding:Positioned/None-positioned
去金球
X-Ray Application
SAM Application
 
De-Gold Bump

移除植于液晶驱动芯片 Pad上的金凸块, 保持Pad完好无损, 以利后续分析或rebonding.

 
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